DYMAN project
The DYMAN project, “DYnamically MANaged self–cooling HPC Data Centers“ consists of developing an innovative design of adsorption chillers and a new type of adsorption heat exchangers.
OBJECTIVES
DYMAN, funded by the European Innovation Council (EIC) and the SMEs Executive Agency (EISMEA), framed in the call: HORIZON–EIC–2023– PATHFINDERCHALLENGES–01, aims to develop an innovative design of adsorption chillers based on new low–temperature adsorbents that reach high capacities at very low conduction temperatures, below 50°C, and a new type of adsorption heat exchangers made of 3D printed structures, which reduce internal thermal resistances and improve heat transfer by two–phase flow, improving the heat transfer rate and reducing the internal electrical consumption of the unit.
In addition, the project aims to further develop an existing two–phase cooling system for high–performance computing servers to handle the thermal loads more efficiently of next–generation processors. It also aims to recover 50% of the waste heat from the processors to generate additional cooling power through a sorption heat pump.
IDP coordinates the project and leads three work packages with the main objectives of testing the hardware developed within the test labs, facilitating the effective realization of DYMAN‘s objectives within the established deadlines, budget limits and quality standards, and exploring synergies and collaborations between the projects in the portfolio to maximize the achievement of scientific results.
OTHER RESOURCES
“Funded by the European Union. Views and opinions expressed are however those of the author(s) only and do not necessarily reflect those of the European Union or [European Innovation Council and SMEs Executive Agency (EISMEA). Neither the European Union nor the granting authority can be held responsible for them.”
